发明名称 PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS
摘要 Provided are photoresist compositions useful in forming photolithographic patterns by a negative tone development process. Also provided are methods of forming photolithographic patterns by a negative tone development process and substrates coated with the photoresist compositions. The photoresist compositions include one or more polymer additive that contains a basic moiety and which is substantially non-miscible with a resin component of the resist. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.
申请公布号 US2016103393(A1) 申请公布日期 2016.04.14
申请号 US201514881760 申请日期 2015.10.13
申请人 Rohm and Haas Electronic Materials LLC 发明人 PARK Jong Keun;LEE Christopher Nam;ANDES Cecily;WANG Deyan
分类号 G03F7/038;G03F7/20;G03F7/30 主分类号 G03F7/038
代理机构 代理人
主权项 1. A photoresist composition, comprising: a first polymer comprising an acid labile group; a second polymer comprising: a first unit formed from a first monomer having the following general formula (I): wherein: P is a polymerizable functional group; R1 is chosen from substituted and unsubstituted C1 to C20 linear, branched and cyclic hydrocarbons; Z is a spacer unit chosen from substituted and unsubstituted linear or branched aliphatic and aromatic hydrocarbons, and combinations thereof, optionally with one or more linking moiety chosen from —O—, —S— and —COO—; and n is an integer from 0 to 5; anda second unit formed from a second monomer having a basic moiety, wherein the first monomer and the second monomer are different;wherein the second polymer is insoluble in alkaline developer, is free of acid-labile groups, and has a surface energy lower than a surface energy of the first polymer; a photoacid generator; and a solvent.
地址 Marlborough MA US
您可能感兴趣的专利