| 摘要 |
An object of the present invention is to provide to a substrate processing apparatus and a substrate processing method, which can improve the treatment performance and reduce the usage of treatment liquid. According to one embodiment, a substrate processing apparatus (1) includes a first liquid supplier (3a), a second liquid supplier (3b), and a controller (5). The first liquid supplier (3a) supplies a substrate (W) with sulfuric acid solution having a first temperature equal to or higher than the boiling point of hydrogen peroxide water. The second liquid supplier (3b) supplies a surface (Wa) to be treated of the substrate (W) with a mixture of sulfuric acid solution and hydrogen peroxide water having a second temperature lower than the first temperature. The controller (5) controls the first liquid supplier (3a) to supply the sulfuric acid solution so as to heat the substrate (W) to the boiling point of hydrogen peroxide water or higher. When the temperature of the substrate (W) is equal to or higher than the second temperature, the controller (5) controls the first liquid supplier (3a) to stop supplying the sulfuric acid solution and controls the second liquid supplier (3b) to supply the mixture having the second temperature. |
