| 发明名称 |
Thermal Conduction To A Cylindrical Shaft |
| 摘要 |
A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided. |
| 申请公布号 |
US2016088776(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201414490186 |
申请日期 |
2014.09.18 |
| 申请人 |
Artesyn Embedded Computing, Inc. |
发明人 |
CORNES Martin Peter John;WONG Suzanne Marye;ARMSTRONG Ross L.;SANDY Douglas L. |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A canister system comprising:
a cylindrical housing; a modular electronic rack system disposed within said cylindrical housing, said modular electronic rack system having a thermal contact member, said thermal contact member being in at least selective physical contact with an interior surface of said cylindrical housing to permit conductive heat transfer there through; an input/output device extending along at least a portion of said modular electronic rack system, said input/output device having a power input and a signal output electrically coupled thereto; and a plurality of electronic slots disposed at a position generally along said modular electronic rack system. |
| 地址 |
Tempe AZ US |
