| 摘要 |
A semiconductor package according to the technological idea of the present invention includes: a semiconductor chip which comprises a first plane and a second plane opposite to the first plane; a through-electrode which passes through between the first plane and the second plane; a passivation layer which is formed on the second plane of the semiconductor chip; and an electrode pad which is formed on an upper plane of the passivation layer, and is electrically connected to the through-electrode. The passivation layer includes a first passivation layer formed on the second plane and a second passivation layer formed on an upper plane of the first passivation layer. The electrode pad is connected by bordering the upper plane of the through-electrode, and borders the upper plane of the first passivation layer by penetrating the second passivation layer. The semiconductor package can prevent a fault due to external stress. |
