| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component built-in wiring board and a manufacturing method for the same that is adaptable to miniaturization of electronic components while suppressing degradation in connection reliability of a conductor pad.SOLUTION: An electronic component built-in wiring board 100 has a board 10 with a cavity in which an interposer 80 as an electronic component is accommodated in a cavity 30, an F-face outer built-up conductor layer 22F formed on the board 10 with the cavity, and plural openings 27 which are formed in a solder resist layer 29F on the F-face outer built-up conductor layer 22F to make a part of the F-face outer built-up conductor layer FF be exposed as a conductor pad 23. The conductor pad 23 has a first conductor pad 23A disposed at the outside of the electronic component when viewed in the thickness direction, and a second conductor pad 23B which is overlapped with and connected to the electronic component. The aperture of the second opening 27B through which the second conductor pad 23B is exposed is smaller than the aperture of the first opening 27A through which the first conductor pad 23A is exposed.SELECTED DRAWING: Figure 2 |
