| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device which can achieve downsizing and cost reduction of the power conversion device and which can improve vibration resistance of a control substrate.SOLUTION: A power conversion device includes a semiconductor module, a cooler for cooling the semiconductor module, a control substrate connected with the semiconductor module, a terminal for connecting the semiconductor module and the control substrate, and a bus bar for connecting the semiconductor module with an input terminal and an output terminal, in which at least one of a C-plane, S-plane and a lateral face is made to contact a reinforcement member and be fixed to the reinforcement member. |
