发明名称 ZINC-NICKEL ALLOY PLATING SOLUTION AND PLATING METHOD
摘要 To provide a high-nickel plating bath which is weakly acidic and can stably form a plating film having a nickel content of 11 to 19% (preferably 12 to 18%) even at a current density of 3 A/dm2 or more. An acidic zinc-nickel alloy electroplating solution which contains an amine compound represented by the formula H2N—R1-R2 {wherein: R1 is [(CH2)M—NH]L or (CH2)N; R2 is H, NH2, or R3; R3 is an alkanol or alkoxyl group having 1, 2, 3, 4, or 5 carbon atoms; L is 2, 3, 4, or 5; M is 2, 3, 4, or 5; and N is 3, 4, or 5}.
申请公布号 US2016068984(A1) 申请公布日期 2016.03.10
申请号 US201414779344 申请日期 2014.03.24
申请人 NIPPON HYOMEN KAGAKU KABUSHIKI KAISHA 发明人 Omachi Mitsuhiro;Kaneko Atsushi;Ito Satoshi
分类号 C25D3/56 主分类号 C25D3/56
代理机构 代理人
主权项 1. An acidic zinc-nickel alloy electroplating solution, the plating solution comprising: (1) a zinc ion; (2) a nickel ion; (3) an electroconductive salt; (4) a pH buffering agent; and (5) an amine compound represented by the following Formula: H2N—R1-R2where, R1 represents [(CH2)M—NH]L or (CH2)N; R2 represents H, NH2, or R3; R3 represents an alkanol or alkoxyl group having 1, 2, 3, 4, or 5 carbon atoms; L is 2, 3, 4, or 5; M is 2, 3, 4, or 5; and N is 3, 4, or 5.
地址 Tokyo JP