发明名称 |
ZINC-NICKEL ALLOY PLATING SOLUTION AND PLATING METHOD |
摘要 |
To provide a high-nickel plating bath which is weakly acidic and can stably form a plating film having a nickel content of 11 to 19% (preferably 12 to 18%) even at a current density of 3 A/dm2 or more. An acidic zinc-nickel alloy electroplating solution which contains an amine compound represented by the formula H2N—R1-R2 {wherein: R1 is [(CH2)M—NH]L or (CH2)N; R2 is H, NH2, or R3; R3 is an alkanol or alkoxyl group having 1, 2, 3, 4, or 5 carbon atoms; L is 2, 3, 4, or 5; M is 2, 3, 4, or 5; and N is 3, 4, or 5}. |
申请公布号 |
US2016068984(A1) |
申请公布日期 |
2016.03.10 |
申请号 |
US201414779344 |
申请日期 |
2014.03.24 |
申请人 |
NIPPON HYOMEN KAGAKU KABUSHIKI KAISHA |
发明人 |
Omachi Mitsuhiro;Kaneko Atsushi;Ito Satoshi |
分类号 |
C25D3/56 |
主分类号 |
C25D3/56 |
代理机构 |
|
代理人 |
|
主权项 |
1. An acidic zinc-nickel alloy electroplating solution, the plating solution comprising:
(1) a zinc ion; (2) a nickel ion; (3) an electroconductive salt; (4) a pH buffering agent; and (5) an amine compound represented by the following Formula:
H2N—R1-R2where,
R1 represents [(CH2)M—NH]L or (CH2)N; R2 represents H, NH2, or R3; R3 represents an alkanol or alkoxyl group having 1, 2, 3, 4, or 5 carbon atoms; L is 2, 3, 4, or 5; M is 2, 3, 4, or 5; and N is 3, 4, or 5. |
地址 |
Tokyo JP |