| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip chip-mounted semiconductor device, which is reduced in the warp quantity and in which a semiconductor element is protected properly. <P>SOLUTION: A semiconductor device manufacturing method includes: flip-chip connecting a semiconductor element 2 and a resin circuit board 4 through a bump electrode 3 formed on the semiconductor element 2; sealing a gap between the semiconductor element 2 and the resin circuit board 4 with a first resin 5; covering a face of the resin circuit board 4 with the semiconductor element 2 mounted thereon with a second resin 6 different from the first resin 5 in its entirety; providing a concavity 7 in part of the second resin 6 covering the semiconductor element 2; and putting, in the concavity 7, a third resin other than the first and second resins 5 and 6 or metal 8. <P>COPYRIGHT: (C)2012,JPO&INPIT |
