| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure for enabling transfer of a shape in a transfer part on a semiconductor substrate surface without immersing the semiconductor substrate in a solution. <P>SOLUTION: A semiconductor manufacturing apparatus transferring a shape in a transfer part on a semiconductor substrate surface supplies a solution to a rear face of the transfer part acting as catalyst of the solution; presses the rear face of the transfer part so as to bring a surface of the transfer part into contact with the semiconductor substrate surface; horizontally moves the transfer part with pressing the rear face of the transfer part; and inserting, during the horizontal movement, the solution supplied to the rear face into a hole on the rear face of the transfer part, which penetrates through the contacting transfer part surface and the semiconductor substrate surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
