| 发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM, AND SEMICONDUCTOR MANUFACTURING METHOD |
| 摘要 |
The semiconductor manufacturing apparatus includes a film forming part and a control part. The film forming part forms a stacked film on a semiconductor substrate. The stacked film has a lower layer and an upper layer on the lower layer. The control part controls the film forming part. The control part controls the film forming part to form the upper layer film in which an inclination of a film thickness is inverted with respect to that of the lower layer film. |
| 申请公布号 |
US2016064262(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514656762 |
申请日期 |
2015.03.13 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
OOSAKI Yoshihisa;MEGURO Mitsuyoshi;HONDA Shouji;IDE Yuuji;KURITA Masato;INOUE Tomofumi |
| 分类号 |
H01L21/67;C23C16/52;H01L21/02;C23C16/455;H01L21/66;C23C16/50;C23C16/46 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor manufacturing apparatus comprising:
a film forming part forming a stacked film on a semiconductor substrate, the stacked film having a lower layer and an upper layer on the lower layer; and a control part controlling the film forming part, wherein the control part controls the film forming part to form the upper layer film in which an inclination of a film thickness in a plane of the semiconductor substrate is inverted with respect to that of the lower layer film. |
| 地址 |
Tokyo JP |
