Capacitance touch panel module and fabrication method thereof

摘要

A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

主权项

1. A method of fabricating a capacitance touch panel, comprising:
forming a substrate comprising a touching area and a peripheral area around the touching area; forming a plurality of insulated protrusions in the touching area; forming an insulated frame in the peripheral area; forming a plurality of first conductive patterns arranged in a plurality of rows along a first orientation; forming a plurality of second conductive patterns arranged between neighboring rows of the first conductive patterns, wherein the first conductive patterns are electrically insulated from the second conductive patterns; forming a plurality of connecting portions, wherein each connecting portion connects two neighboring first conductive patterns arranged in a row; wherein each insulated protrusion is dome-shaped with a curved surface and covers one of the connecting portions; and forming a bridging member on one of the insulated protrusions, and electrically connecting two neighboring second conductive patterns.