Electronic component mounting package and electronic apparatus using the same

摘要

An electronic component mounting package includes a first base including an upper surface and a first through-hole vertically formed; a second base having a second through-hole arranged to be overlapped with the first through-hole in a plan view; a sealing material filling the second through-hole; and a signal terminal that is fixed to the second base to pass through the sealing material and has an upper end portion that protrudes upwardly from the upper surface of the first base. The first base includes a plurality of first metal members and a second metal member, and the second metal member is vertically interposed between the plurality of first metal members. A thermal expansion coefficient of the first metal members is larger than a thermal expansion coefficient of the second base. A thermal conductivity of the second metal member is higher than a thermal conductivity of the first metal members.

主权项

1. An electronic component mounting package, comprising:
a first base comprising:
an upper surface comprising a mounting section on which an electronic component is mounted;a lower surface opposed to the upper surface; anda first through-hole that is vertically formed; a second base bonded to a periphery of the lower surface, the second base comprising a second through-hole that is vertically formed and is overlapped with the first through-hole in a plan view; a sealing material that fills the second through-hole; and a signal terminal fixed to the second base to pass through the sealing material, the signal terminal passing through the first through-hole, and the signal terminal comprising an upper end portion protruding upwardly from the upper surface of the first base, the first base comprising a plurality of first metal members and a second metal member, the second metal member being vertically interposed between the plurality of first metal members, and a thermal expansion coefficient of the first metal members being larger than a thermal expansion coefficient of the second base, and a thermal conductivity of the second metal member being higher than a thermal conductivity of the first metal members.