| 摘要 |
A forging die device is configured in such a manner that die heating heater plates 11, 21 are disposed respectively between a die 1 which is held at the outer periphery by die holders 12, 22, and die holding means 14a, 24a composed of heat insulating plates 13, 23 and die plates 14, 24, and the die holders, the die holding means and the die plates are integrated together. After the preheated die 1 is placed on the heated die holding means, the die 1 is heated by heating means, and forming surfaces 10a, 20a of the die are heated to a required temperature immediately before forging. |
