SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR MODULES

摘要

The present invention provides a semiconductor package and a semiconductor module. According to the present invention, the semiconductor module comprises: a module substrate; and a semiconductor package mounted on the module substrate. A substrate of the semiconductor package has a top surface and a bottom surface wherein the top surface is flat and the bottom surface includes a first region and a second region having a lower level than the first region. A lower surface of a connection portion on the second region has a lower level than a lower surface of a connection portion on the first region. The connection portions are electrically connected to the module substrate on the bottom surface of the substrate.