ELECTROLESS GOLD PLATING LIQUID

摘要

The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained.

主权项

1. An electroless gold plating liquid comprising:
deionized water; a water-soluble gold compound; a complexing agent; a pH buffer; a pH control agent; a reductant; and a palladium ionic catalyst activator, wherein the palladium ionic catalyst activator is a carboxyl amide compound represented by the following Formula 1: (where R′ and R″ are CH3, C2H5, CH2OH, or C2H4OH, and n is an integer in a range of 2 to 5).