发明名称 |
Micro positioning test socket and methods for active precision alignment and co-planarity feedback |
摘要 |
Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques. |
申请公布号 |
US9255945(B2) |
申请公布日期 |
2016.02.09 |
申请号 |
US201414202291 |
申请日期 |
2014.03.10 |
申请人 |
Intel Corporation |
发明人 |
Detofsky Abram M.;Albertson Todd P.;Shia David |
分类号 |
G01R31/00;G01R1/04;G01B7/31;G01R1/067;G01R31/28;H05K1/02 |
主分类号 |
G01R31/00 |
代理机构 |
Winkle, PLLC |
代理人 |
Winkle, PLLC |
主权项 |
1. A method comprising;
providing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing; and micro adjusting the device by utilizing a fiber optic alignment system wherein as the device is scanned across a fiber probe disposed in the socket housing, a maximum detected in a reflected optical power from an alignment package ball disposed in the device indicates optimal alignment of the device. |
地址 |
Santa Clara CA US |