SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

摘要

A semiconductor device includes a first substrate having an attaching surface on which first electrodes and a first insulating film are exposed, an insulating thin film that covers the attaching surface of the first substrate, and a second substrate which has an attaching surface on which second electrodes and a second insulating film are exposed and is attached to the first substrate in a state in which the attaching surface of the second substrate and the attaching surface of the first substrate are attached together sandwiching the insulating thin film therebetween, and the first electrodes and the second electrodes deform and break a part of the insulating thin film so as to be directly electrically connected to each other.

主权项

1. An electronic apparatus comprising:
a semiconductor device including:
a first substrate having an attaching surface including a surface of first electrodes and a surface of a first insulating film, wherein the first substrate is a sensor substrate;an insulating thin film that covers the attaching surface of the first substrate; anda second substrate having an attaching surface including a surface of second electrodes and a surface of a second insulating film and is attached to the first substrate in a state in which the attaching surface of the second substrate and the attaching surface of the first substrate are attached together sandwiching the insulating thin film therebetween, and the first electrodes and the second electrodes are deformed in a manner that breaks a part of the insulating thin film such that the first electrodes and second electrodes are directly electrically connected to each other, wherein the second substrate is a circuit substrate.