SOLDER ALLOY AND JOINT THEREOF

摘要

A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 μm or less.

主权项

1. A solder joint, comprising:
a joint in which at least a surface layer is silver is joined by a solder alloy composed of 2 to 9 weight % of zinc, 0.0001 to 0.1 weight % of manganese, and a remainder of tin, wherein the solder joint has a joint boundary in which a a silver-zinc intermetallic compound formed of Ag silver of the surface layer of the joint and zinc in the solder alloy has a grain size of 5 μm or less.