发明名称 Vehicle noise-proof cover
摘要 A vehicle noise-proof cover is provided which includes a thermoelectric element and which is capable of efficiently generating electric power. The vehicle noise-proof cover is placed so as to cover a driving force generating device of a vehicle. The vehicle noise-proof cover includes: a cover body having a noise absorption layer made of a foamed resin; a heat supply member having a heat collection portion that is placed on a back surface side of the cover body and directly or indirectly contacts the driving force generating device, a heat supply portion that is placed on a front surface side of the cover body, and a heat transfer portion that is connected to the heat collection portion and the heat supply portion and transfers heat from the heat collection portion to the heat supply portion.
申请公布号 US9243821(B2) 申请公布日期 2016.01.26
申请号 US201414312963 申请日期 2014.06.24
申请人 SUMITOMO RIKO COMPANY LIMITED 发明人 Hasegawa Koichi
分类号 F25B21/02;B60R13/08;F02B77/13 主分类号 F25B21/02
代理机构 Greenblum & Bernstein, P.L.C. 代理人 Greenblum & Bernstein, P.L.C.
主权项 1. A vehicle noise-proof cover that is placed so as to cover a driving force generating device of a vehicle, comprising: a cover body having a noise absorption layer made of a foamed resin; a heat supply member having a heat collection portion that is placed on a back surface side of the cover body and directly or indirectly contacts the driving force generating device, a heat supply portion that is placed on a front surface side of the cover body, and a heat transfer portion that is connected to the heat collection portion and the heat supply portion and transfers heat from the heat collection portion to the heat supply portion; and a thermoelectric element that is placed so that one end of the thermoelectric element contacts the heat supply portion of the heat supply member, and therein generates an electromotive force due to a temperature difference between the one end and the other end of the thermoelectric element by the Seebeck effect.
地址 Aichi JP