| 摘要 |
A breaking machine for semiconductor packages is disclosed. The disclosed breaking machine comprises: two rails for moving a lead frame which is installed in a main body of the machine and packaged as a matrix type; a loading device which is installed on a current side of the two rails and loads the lead frame; a first cutter which is installed on one side of the two rails, and has four first striking members in a rectangular form to be vertically movable to produce a first cutting lead frame by having the first striking member strike the edge of the lead frame to cut the edge; a support which is installed to connect to a downstream side of the two rails, and supports the first cutting lead frame by receiving the first cutting lead frame from the two rails; a second cutter which is installed on a downstream side of the support, and has a second striking member to be vertically movable to produce a second cutting lead frame by having the second striking member strike and cut the first cutting lead frame line, line by line, in a longitudinal direction; a line cutting transfer rail which is installed on the downstream side of the support to be perpendicular thereto, has a plurality of first rail grooves, and transfers multiple second cutting lead frames produced by the second cutter to the downstream side while being inserted into the first rail grooves; and a third cutter which is installed on the downstream side of the line cutting transfer rail, and has a third striking member to be vertically movable to produce a plurality of individual packages by having the third striking member cut the plurality of second cutting lead frames all at once. |
