| 摘要 |
Provided are a lead-free oxide bonding material and a joint using the same with which the component system is simple, operability and workability are good, the melting point is low and joint strength and air-tight sealability are excellent, and when a base or substrate having a different linear thermal expansion coefficient is bonded, heat resistance of 300ºC or greater, vacuum-tightness, and joint strength can be realized. The invention provides a bonding material formed from a solder alloy that is 0.005 to 2.0 wt% of Mg, 0.0005 to 1.0 wt% of Y, and substantially Sn as the balance; a bonding material obtained by mixing a lead-free, low-melting-point glass powder, polyether ether ketone or polyether sulfone resin powder, and the like with a powder of the solder alloy; and joints that use these bonding materials. As a result, it is possible to join oxide materials such as ceramics and glass or a variety of substrates having a surface oxide film without cracking or peeling, and a joint having excellent heat resistance, vacuum-tightness, and joint strength is obtained. |
