Probing device and manufacturing method thereof

摘要

A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

主权项

1. A probing device, comprising:
a printed circuit board; a reinforcing plate, wherein the reinforcing plate is disposed on the printed circuit board and the internal circuitry of the reinforcing plate is electrically connected to internal circuitry of the printed circuit hoard; a plurality of space transformers, disposed on the reinforcing plate, wherein a plurality of first pads and a plurality of second pads are disposed on each space transformer, at least a portion of the second pad covers and directly contacts the first pad, and a plurality of upper surfaces of the plurality of second pads form a flat plane; and a probe head, comprising a plurality of probing areas, wherein the probing area comprises a plurality of probes and the plurality of probes are electrically connected to the internal circuitry of the space transformer via the second pads; wherein a center line of at least one second pad does not overlap a center line of the first pad being covered below the second pad.