CHIP ON GLASS BONDING INSPECTION APPARATUS

摘要

The present invention relates to a chip-on-glass bonding inspection device comprising: a base; an object to be inspected placed in parallel with the base; a first photographing device mounted on the base to be positioned under the object, and photographing a lower part of the object by a line scanning method using light reflected after irradiating visible rays to the object while moving in a specific scanning direction with respect to the object; a second photographing device mounted on the base to be positioned above the object, and photographing an upper part of the object by the line scanning method using light reflected after irradiating infrared rays to the object while moving in the specific scanning direction with respect to the object; a driving unit to move the first and second photographing devices in the scanning direction; and a control device controlling the driving unit and transmitting a first line trigger signal and a second line trigger signal synchronized to a moving speed in the scanning direction of the first and second photographing devices. According to the present invention, an alignment inspection and an indentation inspection used to separately be performed in different devices are simultaneously performed by one device; thus reducing inspection hours, installation space, and costs of the device.