CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

摘要

A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die. Amaterial providing fluidic or electrical or photonic or magnetic or mechanical connection to the die is the placed in the channel.