| 摘要 |
It is an object of the present invention to provide a curable resin composition, having excellent workability (thixotropic properties and applicability) required in applications such as floor adhesives, without causing a decrease in mechanical properties, which contains an organic polymer having a reactive silicon group. The object is attained by a curable resin composition including: an organic polymer (A) having a reactive silicon group; a filler (B) obtained through a combination of three types of filler, namely a filler (B1) having an average particle diameter of less than 0.5 µm, a filler (B2) having an average particle diameter of not less than 0.5 µm to less than 10 µm, and a filler (B3) having an average particle diameter of not less than 10 µm.
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