摘要 |
<p>Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.</p> |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY;LARSON, ERIC, G.;KROPP, MICHAEL, A.;PLAUT, DAVID J.;MOORE, CHERYL, L. |
发明人 |
LARSON, ERIC, G.;KROPP, MICHAEL, A.;PLAUT, DAVID J.;MOORE, CHERYL, L. |