| 摘要 |
<P>PROBLEM TO BE SOLVED: To attain suppression of chipping during dicing, in a rear-side irradiation type solid-state imaging apparatus which adopts three-dimensional mounting techniques. <P>SOLUTION: A chipping-preventing wall 53 is formed between a blade area 4 and a solid-state imaging element 2 inside a scribe line 3 on a semiconductor substrate 32. Furthermore, a guard ring 54 is formed in the area of a wiring layer 38, corresponding to an area between the blade area 4 and the chipping-preventing wall 53 inside the scribe line 3 on the semiconductor substrate 32. <P>COPYRIGHT: (C)2011,JPO&INPIT |
