发明名称 SOLDERING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent a substrate from erroneous conveyance and measurement, as well as to prevent an alarm from malfunctioning when measuring a temperature profile in a soldering device. <P>SOLUTION: In a reflow device 100, an alarm sound is set to be generated a determined few seconds before a substrate arrives at a discharge opening of a reflow device body right after a mode is changed from a production mode to a temperature profile mode. A control section calculates an alarm sound generation time at which an alarm sound is generated, depending on a set time of a substrate pre-discharge alarm and the like, and turns off a ready signal to be provided to a device in a preceding stage, a substrate congestion detection function, and a substrate drop detection function, respectively (S400, S410). After a sensor part at an installation opening side detects whether the substrate has been installed into the reflow device body or not (S420), the control section determines if the alarm sound generation time has elapsed (S430). A notification section notifies a user by generating the alarm sound that the substrate is approaching the discharge opening after the control section determines that the generation time has elapsed (S440). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011222784(A) 申请公布日期 2011.11.04
申请号 JP20100090969 申请日期 2010.04.09
申请人 SENJU METAL IND CO LTD 发明人 OTASHIRO TADAYOSHI;INOUE HIROYUKI
分类号 H05K3/34;B23K1/00;B23K1/008;B23K101/42 主分类号 H05K3/34
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