| 摘要 |
<P>PROBLEM TO BE SOLVED: To inhibit grease from running out when a card like semiconductor device is inserted between a pair of cooling members, and to inhibit the deterioration of heat conductivity and the deterioration of the cooling efficiency of the semiconductor device which results from the grease running out. <P>SOLUTION: In a semiconductor module 1, a card like semiconductor device 10 where grease 30 is applied on both surfaces is inserted into a pair of cooling members 20 which has a coolant passage therein, and a recessed part 11 is formed on a grease application surface of the semiconductor device 10. A recessed part may be provided on a grease application surface of the cooling members 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
