| 摘要 |
The instant disclosure relates to a heat dissipating device capable of mounting on at least one heat conducting pipe. The heat dissipating device includes a heat dissipating fin having a main body. At least one through hole is formed on the main body. At least one set of ribs is formed on the main body and around the through hole. A slot is defined between any two adjacent ribs. The through hole of the main body is for insertion of the heat conducting pipe in allowing the ribs to grip resiliently against the heat conducting pipe. Thus, the heat dissipating device of the instant disclosure enables multiple heat dissipating fins to be stacked on the heat conducting pipe in one run. In saving assembly time, the heat dissipating fins need not be mounted on the heat conducting pipe one piece after another.
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