| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate manufacturing method which can suppress warp and variation in a dimension of the ceramic multilayer substrate; and which can sufficiently ensure flatness of a substrate surface.SOLUTION: A ceramic multilayer substrate manufacturing method comprises: preparing an adhesive ceramic sheet 33 which includes at least a ceramic material, an adhesive and an organic compound that melts by heating, and which is formed in a sheet; and heating a plurality of adhesive ceramic sheets 33 after lamination to a temperature of not less than a melting point of the organic compound, and applying pressure to each adhesive ceramic sheet 33 in a lamination direction in a state where the adhesive ceramic sheets 33 exhibits adhesion expressed in a tensile strength of 50 gF and over. As a result, while unfired conductors 41 are embedded in both adhesive ceramic sheets 33 which are adjacent to each other on surfaces and rear faces of the unfired conductors 41, an unfired ceramic laminate 42 in which the adhesive ceramic sheets 33 are integrated is formed. |
