发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
摘要 A printed circuit board according to an embodiment of the present invention may comprise: a base substrate having a circuit pattern formed thereon; and a donut-shaped thermal via formed within the base substrate. The printed circuit board and method for manufacturing a printed circuit board according to an embodiment of the present invention can increase the heat-radiating performance by increasing the area of the thermal via.
申请公布号 KR20150050533(A) 申请公布日期 2015.05.08
申请号 KR20150027562 申请日期 2015.02.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OH, CHANG GUN;OH, HWA SUB;PARK, HO SIK
分类号 H05K1/02;H05K3/00;H05K3/42 主分类号 H05K1/02
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