发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF |
摘要 |
A printed circuit board according to an embodiment of the present invention may comprise: a base substrate having a circuit pattern formed thereon; and a donut-shaped thermal via formed within the base substrate. The printed circuit board and method for manufacturing a printed circuit board according to an embodiment of the present invention can increase the heat-radiating performance by increasing the area of the thermal via. |
申请公布号 |
KR20150050533(A) |
申请公布日期 |
2015.05.08 |
申请号 |
KR20150027562 |
申请日期 |
2015.02.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
OH, CHANG GUN;OH, HWA SUB;PARK, HO SIK |
分类号 |
H05K1/02;H05K3/00;H05K3/42 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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