| 摘要 |
PROBLEM TO BE SOLVED: To enable high heat dissipation, as well as easy manufacturing, by devising the disposition of a heat sink.SOLUTION: By the provision of a resin film 2 on the bottom face side of an overall circuit element to which a lead 1 is connected, a mold resin is formed on one upper side from a lead bottom face position which includes a lead side face part, the circuit element and the connection thereof. Further, using a plurality of one-side resin mold elements 10 having substantially planar rear faces, the lead 1 is connected to an electrode 13 of a substrate 11 in such a manner that the rear faces of the plurality of one-side resin mold elements 10 align on an identical horizontal plane. A single heat sink is mounted on the rear face of the plurality of one-side resin mold elements 10. |
