| 摘要 |
A detecting method for improving the resolution of an area array probe. The method comprises the following steps: Step 1, providing N wafers (9, 10, 11, 12) on an ultrasonic area array probe, the N wafers (9, 10, 11, 12) being arranged in an area array; Step 2, controlling a wafer a (9) by a chip (2) to transmit m pulse waves toward a to-be-detected workpiece; Step 3, sequentially and respectively receiving by the wafer a (9) and (m-1) wafers adjacent to the wafer a (9) the pulse waves reflected by the to-be-detected workpiece; Step 4, transmitting m pulse waves by each of the N wafers (9, 10, 11, 12), and receiving all the pulse waves reflected by the to-be-detected workpiece; Step 5, repeating the process from Step 1 to Step 4 till flaw detection is finished; and Step 6, obtaining by a main machine (1) a defect diagram of the to-be-detected workpiece by means of analytical processing of the received pulse waves, and displaying the defect diagram by means of a display on the main machine (1). The resolution of an area array detecting instrument is greatly improved by means of the above transmitting and receiving manners. |
