| 摘要 |
An array substrate (11b) is provided with: a driver (21); a glass substrate (GS) provided with a driver-mounted section (GSs1) where the driver (21) is mounted; an anisotropic conductive material (27) which is disposed between the driver (21) and the driver-mounted section (GSs1), is electrically connected to both the driver (21) and the driver-mounted section (GSs1), and is provided with at least a binder (27b) comprising a thermosetting resin, and conductive particles (27a) included in the binder (27b); and heat supply units (28) which are provided to at least the driver-mounted section (GSs1) of the glass substrate (GS), and which are for supplying heat to the anisotropic conductive material (27). |
