发明名称 超短パルスレーザ加工装置
摘要 <p>An ultrashort pulse laser processing apparatus for processing a processing target includes: a laser head which includes a seed laser source emitting an ultrashort pulse seed laser, and emits a laser pulse; an optical fiber which guides the laser pulse emitted from the laser head; and an emission end unit which includes a compressor that compresses the laser pulse emitted from the optical fiber to a laser pulse of a predetermined high peak power and emits the laser pulse compressed by the compressor to the target.</p>
申请公布号 JP5824825(B2) 申请公布日期 2015.12.02
申请号 JP20110045249 申请日期 2011.03.02
申请人 株式会社ニデック 发明人 天野 正典
分类号 B23K26/073;B23K26/064;H01S3/00 主分类号 B23K26/073
代理机构 代理人
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