发明名称 両頭平面研削法及び両頭平面研削盤
摘要 A double sided grinding method of the present invention is provided to easily and fixedly determine the grinding location of a thin film type work at the center between both constant pressure pads and to perform grinding from the initial product immediately after the set up at the predetermined grinding accuracy. According to the double sided grinding method, when both surfaces of a work (W) are grinded by a pair of grinding wheels (3, 4), the work (W) is pushed to pressure pads (1, 2) on one side of constant pressure support locations (H1, H2) while a thin film type work (W) which is supported by the pair of constant pressure pads (1, 2) in the constant pressure rotates. The work (W) is floated, by the predetermined amount, from the constant pressure pads (1, 2) on one side by the grinding wheels that are stopped to rotate while the grinding wheels (3, 4) on one side of the constant pressure pads (1, 2) move forward. The operation that the location of the grinding wheels (3, 4) when the work is floated by the determined amount is temporarily determined is performed at right and left. The work (W) is supported by both constant pads (1, 2) in the constant pressure.
申请公布号 JP5820329(B2) 申请公布日期 2015.11.24
申请号 JP20120098547 申请日期 2012.04.24
申请人 光洋機械工業株式会社 发明人 芝中 篤志
分类号 B24B7/16;B24B41/06;H01L21/304 主分类号 B24B7/16
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