发明名称 Solar cell emitter region fabrication with differentiated p-type and n-type region architectures
摘要 Methods of fabricating solar cell emitter regions with differentiated P-type and N-type regions architectures, and resulting solar cells, are described. In an example, a back contact solar cell includes a substrate having a light-receiving surface and a back surface. A first polycrystalline silicon emitter region of a first conductivity type is disposed on a first thin dielectric layer disposed on the back surface of the substrate. A second polycrystalline silicon emitter region of a second, different, conductivity type is disposed on a second thin dielectric layer disposed on the back surface of the substrate. A third thin dielectric layer is disposed laterally directly between the first and second polycrystalline silicon emitter regions. A first conductive contact structure is disposed on the first polycrystalline silicon emitter region. A second conductive contact structure is disposed on the second polycrystalline silicon emitter region.
申请公布号 US9196758(B2) 申请公布日期 2015.11.24
申请号 US201314136751 申请日期 2013.12.20
申请人 SunPower Corporation 发明人 Rim Seung Bum;Smith David D.;Qiu Taiqing;Westerberg Staffan;Tracy Kieran Mark;Balu Venkatasubramani
分类号 H01L31/0224;H01L31/068;H01L31/20 主分类号 H01L31/0224
代理机构 Blakely Sokoloff Taylor Zafman LLP 代理人 Blakely Sokoloff Taylor Zafman LLP
主权项 1. A back contact solar cell, comprising: a substrate having a light-receiving surface and a back surface; a first polycrystalline silicon emitter region of a first conductivity type disposed on a first thin dielectric layer disposed on the back surface of the substrate; a second polycrystalline silicon emitter region of a second, different, conductivity type disposed on a second thin dielectric layer disposed on the back surface of the substrate; a third thin dielectric layer disposed laterally directly between the first and second polycrystalline silicon emitter regions; a first conductive contact structure disposed on the first polycrystalline silicon emitter region; and a second conductive contact structure disposed on the second polycrystalline silicon emitter region, wherein the second polycrystalline silicon emitter region and the second thin dielectric layer are disposed in a recess disposed in the substrate and the first polycrystalline silicon emitter region overlaps the second polycrystalline silicon emitter region.
地址 San Jose CA US
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