发明名称 |
UNIFORMITY AND SELECTIVITY OF LOW GAS FLOW VELOCITY PROCESSES IN A CROSS FLOW EPITAXY CHAMBER WITH THE USE OF ALTERNATIVE HIGHLY REACTIVE PRECURSORS THOUGH AN ALTERNATIVE PATH |
摘要 |
Methods for increasing layer uniformity in cross flow layer deposition are described herein. A method of depositing a layer can include delivering a deposition gas to a processing surface of a substrate using the deposition gas delivered through a first port in a first direction, depositing a layer on the processing surface of the substrate, the layer having one or more non-uniformities, and delivering a reactant gas to the layer through a second port in a second direction, the second direction being different from the first direction, the second direction and the first direction forming an azimuthal angle between them with respect to a central axis of the substrate support being up to about 145 degrees, the reactant gas reacting with the layer to diminish at least one of the one or more non-uniformities. The reactant gas can be delivered concurrent with or subsequent to the deposition gas. |
申请公布号 |
US2015329969(A1) |
申请公布日期 |
2015.11.19 |
申请号 |
US201414276979 |
申请日期 |
2014.05.13 |
申请人 |
Applied Materials, Inc. |
发明人 |
ZHU Zuoming;SHEN Kuan Chien;RAMACHANDRAN Balasubramanian |
分类号 |
C23C16/56;C23C16/455;C23C16/24 |
主分类号 |
C23C16/56 |
代理机构 |
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代理人 |
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主权项 |
1. A method for depositing a layer, sequentially comprising:
delivering a deposition gas comprising one or more constituent gases to a processing surface of a substrate, the substrate positioned on a substrate support in a process region of a process chamber, the deposition gas delivered through a first port in a first direction; depositing a layer on the processing surface of the substrate from the deposition gas, the layer having one or more non-uniformities; and delivering a reactant gas to the layer through a second port in a second direction, the second direction being different from the first direction, the second direction and the first direction forming an azimuthal angle between them with respect to a central axis of the substrate support being up to about 145 degrees, the reactant gas reacting with the layer to diminish at least one of the one or more non-uniformities, wherein the reactant gas does not form a deposition product with the deposition gas. |
地址 |
Santa Clara CA US |