发明名称 UNIFORMITY AND SELECTIVITY OF LOW GAS FLOW VELOCITY PROCESSES IN A CROSS FLOW EPITAXY CHAMBER WITH THE USE OF ALTERNATIVE HIGHLY REACTIVE PRECURSORS THOUGH AN ALTERNATIVE PATH
摘要 Methods for increasing layer uniformity in cross flow layer deposition are described herein. A method of depositing a layer can include delivering a deposition gas to a processing surface of a substrate using the deposition gas delivered through a first port in a first direction, depositing a layer on the processing surface of the substrate, the layer having one or more non-uniformities, and delivering a reactant gas to the layer through a second port in a second direction, the second direction being different from the first direction, the second direction and the first direction forming an azimuthal angle between them with respect to a central axis of the substrate support being up to about 145 degrees, the reactant gas reacting with the layer to diminish at least one of the one or more non-uniformities. The reactant gas can be delivered concurrent with or subsequent to the deposition gas.
申请公布号 US2015329969(A1) 申请公布日期 2015.11.19
申请号 US201414276979 申请日期 2014.05.13
申请人 Applied Materials, Inc. 发明人 ZHU Zuoming;SHEN Kuan Chien;RAMACHANDRAN Balasubramanian
分类号 C23C16/56;C23C16/455;C23C16/24 主分类号 C23C16/56
代理机构 代理人
主权项 1. A method for depositing a layer, sequentially comprising: delivering a deposition gas comprising one or more constituent gases to a processing surface of a substrate, the substrate positioned on a substrate support in a process region of a process chamber, the deposition gas delivered through a first port in a first direction; depositing a layer on the processing surface of the substrate from the deposition gas, the layer having one or more non-uniformities; and delivering a reactant gas to the layer through a second port in a second direction, the second direction being different from the first direction, the second direction and the first direction forming an azimuthal angle between them with respect to a central axis of the substrate support being up to about 145 degrees, the reactant gas reacting with the layer to diminish at least one of the one or more non-uniformities, wherein the reactant gas does not form a deposition product with the deposition gas.
地址 Santa Clara CA US
您可能感兴趣的专利