| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in which: when the size of a package for housing an element is reduced, block of the inside and outside of a package becomes difficult because inevitable displacement of an input output terminal occurs due to the resulting reduction of thickness of a standing wall part in a manufacturing process.SOLUTION: A package for housing an element comprises: a first insulation substrate; a second insulation substrate disposed on the first insulation substrate; a wiring conductor disposed between the first insulation substrate and the second insulation substrate; an internal terminal electrically connected to the wiring conductor and disposed inside a region surrounded by a frame in a plan view on a top surface of the second insulation substrate; and an external terminal electrically connected to the wiring conductor and disposed outside a region surrounded by the frame in a plan view on the top surface of the second insulation substrate. |
