| 摘要 |
A thermistor that can be mounted by soldering and offers excellent bonding strength even when formed by a solid-phase method is provided. A method for producing such a thermistor is also provided. The thermistor has a metal substrate, a semiconductor ceramic layer on the metal substrate, and a pair of split electrodes on the semiconductor layer. The semiconductor ceramic layer is formed by a solid-phase method. The metal substrate contains ceramic particles and is not interrupted in the direction of thickness by the ceramic particles or a pillar formed by a chain of the ceramic particles. Preferably, the metal substrate and the ceramic layer of the electronic component have a thickness of 10 to 80 µm and 1 to 10 µm, respectively. |
