| 摘要 |
The present invention relates to a multilayer electronic support structure comprising at least one pair of adjacent feature layers extended in an X-Y plane, separated by a via layer. The via layer comprises a dielectric substance that is interposed between the two adjacent feature layers, and at least one constructional element passing through the dielectric substance between the pair of adjacent feature layers in Z direction perpendicular to the X-Y plane. The constructional element is characterized by having a long dimension in the X-Y plane that is at least three times longer than a short dimension in the X-Y plane, and is fully encapsulated within the dielectric substance to be electrically insulated from surroundings thereof. |
