发明名称 COOLING DEVICE FOR BOARD
摘要 PROBLEM TO BE SOLVED: To provide a cooling device for a board which reduces sound noise.SOLUTION: A cooling device for a board includes: a cooling unit 2; a heat radiation side heat sink 3 attached to the cooling unit 2; and a heat radiation side fan 5. An opening plate material 9 in which multiple opening holes are formed is disposed adjacent to the heat radiation side heat sink 3. It is preferable to dispose the opening plate material 9 between the heat radiation side heat sink 3 and the heat radiation side fan 5.
申请公布号 JP2015195247(A) 申请公布日期 2015.11.05
申请号 JP20140071519 申请日期 2014.03.31
申请人 NITTO KOGYO CO LTD 发明人 ITO KEISHIN
分类号 H05K7/20 主分类号 H05K7/20
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