发明名称 HEAT DISSIPATION ASSEMBLIES
摘要 A coupling (100) for interfacing a heat source to a heat sink for dissipating heat from the heat source includes a first portion (105) and a second portion (110). The first portion defines a surface that defines a plurality of spaced apart voids (117) that extend into the first portion. The second portion has an outside surface (125) that complements the surface of the first portion. The second portion is capable of repeated mate and de- mate cycles from the first portion. A gel (120) is disposed on the interior surface of the cavity. In operation, insertion of the second portion within the cavity causes a portion (122) of the gel to displace into openings at first ends of the voids (117). The gel returns to an original shape when the second portion is removed from the cavity.
申请公布号 WO2015160814(A1) 申请公布日期 2015.10.22
申请号 WO2015US25761 申请日期 2015.04.14
申请人 TYCO ELECTRONICS CORPORATION 发明人 LEWIS, KEVIN;WOODS, JASON, M.;DIMICK, DENNIS, W.
分类号 H01L23/427 主分类号 H01L23/427
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