发明名称 半導体装置およびその製造方法、基板
摘要 <p>According to an embodiment, a semiconductor device includes a substrate provided with a first region including an active element, the substrate including a second region containing boron with a density of 2×1020 cm−3 or more on a surface excluding the first region.</p>
申请公布号 JP5793456(B2) 申请公布日期 2015.10.14
申请号 JP20120068471 申请日期 2012.03.23
申请人 发明人
分类号 H01L21/322;H01L21/336;H01L21/8238;H01L27/092;H01L29/78 主分类号 H01L21/322
代理机构 代理人
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