发明名称 |
TUNNEL INSULATION LAYER STRUCTURES, METHODS OF MANUFACTURING THE SAME, AND VERTICAL MEMORY DEVICES INCLUDING THE SAME |
摘要 |
Disclosed are a tunnel insulating film structure, a method for manufacturing the tunnel insulating film structure and a vertical memory device including the tunnel insulating film structure. The tunnel insulating film structure includes a first tunnel insulating film, a second tunnel insulating film, a third tunnel insulating film, a fourth tunnel insulating film and a fifth tunnel insulating film. The first tunnel insulating film is arranged on a substrate, and has a first band gap energy. The second tunnel insulating film is arranged on the first tunnel insulating film, and has a second band gap energy smaller than the first band gap energy. The third tunnel insulating film is arranged on the second tunnel insulating film, and has a third band gap energy larger than the second band gap energy. The fourth tunnel insulating film is arranged on the third tunnel insulating film, and has a fourth band gap energy smaller than the third band gap energy. The fifth tunnel insulating film is arranged on the fourth tunnel insulating layer, and has a fifth band gap energy larger than the fourth band gap energy. |
申请公布号 |
KR20150113634(A) |
申请公布日期 |
2015.10.08 |
申请号 |
KR20140037880 |
申请日期 |
2014.03.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, EUN YEOUNG;NOH, YOUNG JIN;KIM, BI O;PARK, KWANG MIN;AHN, JAE YOUNG;YUN, JU MI;CHOI, JAE HO;HWANG, KI HYUN |
分类号 |
H01L27/115;H01L21/8247 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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