发明名称 TUNNEL INSULATION LAYER STRUCTURES, METHODS OF MANUFACTURING THE SAME, AND VERTICAL MEMORY DEVICES INCLUDING THE SAME
摘要 Disclosed are a tunnel insulating film structure, a method for manufacturing the tunnel insulating film structure and a vertical memory device including the tunnel insulating film structure. The tunnel insulating film structure includes a first tunnel insulating film, a second tunnel insulating film, a third tunnel insulating film, a fourth tunnel insulating film and a fifth tunnel insulating film. The first tunnel insulating film is arranged on a substrate, and has a first band gap energy. The second tunnel insulating film is arranged on the first tunnel insulating film, and has a second band gap energy smaller than the first band gap energy. The third tunnel insulating film is arranged on the second tunnel insulating film, and has a third band gap energy larger than the second band gap energy. The fourth tunnel insulating film is arranged on the third tunnel insulating film, and has a fourth band gap energy smaller than the third band gap energy. The fifth tunnel insulating film is arranged on the fourth tunnel insulating layer, and has a fifth band gap energy larger than the fourth band gap energy.
申请公布号 KR20150113634(A) 申请公布日期 2015.10.08
申请号 KR20140037880 申请日期 2014.03.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, EUN YEOUNG;NOH, YOUNG JIN;KIM, BI O;PARK, KWANG MIN;AHN, JAE YOUNG;YUN, JU MI;CHOI, JAE HO;HWANG, KI HYUN
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
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