Composite Substrate, Semiconductor Chip Having a Composite Substrate and Method for Producing Composite Substrates and Semiconductor Chips

摘要

A composite substrate has a carrier and a utility layer. The utility layer is attached to the carrier by means of a dielectric bonding layer and the carrier contains a radiation conversion material. Other embodiments relate to a semiconductor chip having such a composite substrate, a method for producing a composite substrate and a method for producing a semiconductor chip with a composite substrate.

主权项

1. A composite substrate comprising:
a carrier; a dielectric bonding layer; and a utility layer attached to the carrier by the dielectric bonding layer; wherein the composite substrate comprises a radiation conversion material; and wherein a refractive index of the dielectric bonding layer decreases from the utility layer towards the carrier.