| 摘要 |
<p>An embodiment of the present invention relates to a light emitting device, a method for manufacturing a light emitting device, a light emitting device package, and a lighting system. The light emitting device according to the embodiment comprises: a substrate(102); an insulation layer(110) on the substrate(102); a first conductive semiconductor layer(132) on the substrate(102) and the insulation layer(110); an active layer(134) on the first conductive semiconductor layer(132); a second conductive semiconductor layer(136) on the active layer(134); a first electrode(151) on the first conductive semiconductor layer(132); and a second electrode(152) on a second conductive semiconductor layer(152).</p> |
