| 发明名称 |
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS |
| 摘要 |
A substrate treatment method is provided, which includes: an organic solvent replacing step of supplying an organic solvent, whereby a liquid film of the organic solvent is formed on the substrate as covering the upper surface of the substrate to replace a rinse liquid with the organic solvent; a substrate temperature increasing step of allowing the temperature of the upper surface of the substrate to reach a first temperature level higher than the boiling point of the organic solvent after the formation of the organic solvent liquid film, whereby a vapor film of the organic solvent is formed below the entire organic solvent liquid film between the organic solvent liquid film and the substrate to levitate the organic solvent liquid film above the organic solvent vapor film; and an organic solvent removing step of removing the levitated organic solvent liquid film from above the upper surface of the substrate. |
| 申请公布号 |
US2015279708(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201514667769 |
申请日期 |
2015.03.25 |
| 申请人 |
SCREEN Holdings Co., Ltd. |
发明人 |
KOBAYASHI Kenji;OKUTANI Manabu |
| 分类号 |
H01L21/67;C23C16/52;H01L21/324;H01L21/673;H01L21/02;H01L21/306;C23C16/46;C23C16/458 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate treatment method comprising:
an organic solvent replacing step of supplying, to an upper surface of a horizontally held substrate, an organic solvent having a lower surface tension than a rinse liquid adhering to the upper surface of the substrate, whereby a liquid film of the organic solvent is formed on the substrate as covering the upper surface of the substrate to replace the rinse liquid with the organic solvent; a substrate temperature increasing step of allowing a temperature of the upper surface of the substrate to reach a predetermined first temperature level higher than a boiling point of the organic solvent after the formation of the organic solvent liquid film, whereby a vapor film of the organic solvent is formed below the entire organic solvent liquid film between the organic solvent liquid film and the upper surface of the substrate to levitate the organic solvent liquid film above the organic solvent vapor film; and an organic solvent removing step of removing the levitated organic solvent liquid film from above the upper surface of the substrate. |
| 地址 |
Kyoto JP |
