发明名称 Mold cleaning sheet and manufacturing method of a semiconductor device using the same
摘要 A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed along the peripheral edge to the outside of the plural cavities of the mating surface of the molding die, the cleaning sheet main body being formed with first through holes at positions corresponding to the cavities of the molding die, air vent slits and flow cavity recesses at positions corresponding to the air vents of the cavities, second through holes at positions corresponding to the pots of the molding die, and slits at positions corresponding to the runners of the molding die, thereby capable of improving the cleaning effect of the molding die and shortening the time for the cleaning operation to improve the productivity.
申请公布号 US2006194372(A1) 申请公布日期 2006.08.31
申请号 US20060417110 申请日期 2006.05.04
申请人 TSUCHIDA KIYOSHI 发明人 TSUCHIDA KIYOSHI
分类号 B29C33/72;H01L21/48;B29C45/02;B29C45/14;B29C45/17;B29L31/34;H01L21/50;H01L21/56 主分类号 B29C33/72
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